Assignee
MA QING
US11 patents
Top patents by PatentIndex Score
US9368429B2Jun 14, 2016
Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips
MA QING86 citations97
US8207453B2Jun 26, 2012
Glass core substrate for integrated circuit devices and methods of making the same
MA QING28 citations92
US9420707B2Aug 16, 2016
Substrate for integrated circuit devices including multi-layer glass core and methods of making the same
MA QING5 citations84
US9297824B2Mar 29, 2016
Techniques, systems and devices related to acceleration measurement
MA QING4 citations73
US10070524B2Sep 4, 2018
Method of making glass core substrate for integrated circuit devices
MA QING2 citations72
US9445496B2Sep 13, 2016
Glass clad microelectronic substrate
MA QING2 citations63
US8068405B2Nov 29, 2011
Ferroelectric memory and method in which polarity of domain of ferroelectric memory is determined using ratio of currents
MA QING2 citations62
US8513966B2Aug 20, 2013
Probes formed from semiconductor region vias
MA QING2 citations61
US9429427B2Aug 30, 2016
Inductive inertial sensor architecture and fabrication in packaging build-up layers
MA QING0 citations52
US8338813B2Dec 25, 2012
Bit-erasing architecture for seek-scan probe (SSP) memory storage
MA QING0 citations52
US8637778B2Jan 28, 2014
Debond interconnect structures
MA QING0 citations49