Assignee
MACDERMID INC
US136 patents
Top patents by PatentIndex Score
US5869130AFeb 9, 1999
Process for improving the adhesion of polymeric materials to metal surfaces
MACDERMID INC149 citations99
US4265943AMay 5, 1981
Method and composition for continuous electroless copper deposition using a hypophosphite reducing agent in the presence of cobalt or nickel ions
MACDERMID INC338 citations97
US5935640AAug 10, 1999
Method for enhancing the solderability of a surface
MACDERMID INC46 citations96
US5747098AMay 5, 1998
Process for the manufacture of printed circuit boards
MACDERMID INC61 citations96
US5733599AMar 31, 1998
Method for enhancing the solderability of a surface
MACDERMID INC53 citations96
US5160579ANov 3, 1992
Process for manufacturing printed circuit employing selective provision of solderable coating
MACDERMID INC86 citations96
US5147692ASep 15, 1992
Electroless plating of nickel onto surfaces such as copper or fused tungston
MACDERMID INC287 citations95
US4944851AJul 31, 1990
Electrolytic method for regenerating tin or tin-lead alloy stripping compositions
MACDERMID INC55 citations95
US5641608AJun 24, 1997
Direct imaging process for forming resist pattern on a surface and use thereof in fabricating printing plates
MACDERMID INC167 citations94
US4804615AFeb 14, 1989
Method for manufacture of printed circuit boards
MACDERMID INC60 citations94
US6281090B1Aug 28, 2001
Method for the manufacture of printed circuit boards with plated resistors
MACDERMID INC69 citations93
US4863758ASep 5, 1989
Catalyst solutions for activating non-conductive substrates and electroless plating process
MACDERMID INC52 citations93
US4603058AJul 29, 1986
Post-treatment of cured, radiation sensitive, polymerizable resins to eliminate surface tack
MACDERMID INC36 citations93
US6200451B1Mar 13, 2001
Method for enhancing the solderability of a surface
MACDERMID INC39 citations92
US6162503ADec 19, 2000
Process for improving the adhesion of polymeric materials to metal surfaces
MACDERMID INC37 citations92
US6146701ANov 14, 2000
Process for improving the adhension of polymeric materials to metal surfaces
MACDERMID INC45 citations92
US6044550AApr 4, 2000
Process for the manufacture of printed circuit boards
MACDERMID INC23 citations92
US5518760AMay 21, 1996
Composition and method for selective plating
MACDERMID INC28 citations92
US5468515ANov 21, 1995
Composition and method for selective plating
MACDERMID INC31 citations92
US5248398ASep 28, 1993
Process for direct electrolytic regeneration of chloride-based ammoniacal copper etchant bath
MACDERMID INC26 citations92
US5017267AMay 21, 1991
Composition and method for stripping tin or tin-lead alloy from copper surfaces
MACDERMID INC46 citations92
US4921571AMay 1, 1990
Inhibited composition and method for stripping tin, lead or tin-lead alloy from copper surfaces
MACDERMID INC42 citations92
US4775444AOct 4, 1988
Process for fabricating multilayer circuit boards
MACDERMID INC46 citations92
US4748104AMay 31, 1988
Selective metallization process and additive method for manufactured printed circuit boards
MACDERMID INC26 citations92
US4608275AAug 26, 1986
Oxidizing accelerator
MACDERMID INC43 citations92
US5759378AJun 2, 1998
Process for preparing a non-conductive substrate for electroplating
MACDERMID INC32 citations91
US5632927AMay 27, 1997
Process for preparing a non-conductive substrate for electroplating
MACDERMID INC24 citations91
US5536386AJul 16, 1996
Process for preparing a non-conductive substrate for electroplating
MACDERMID INC23 citations91
US4976990ADec 11, 1990
Process for metallizing non-conductive substrates
MACDERMID INC65 citations91
US4868066ASep 19, 1989
Mechanically plated coatings containing lubricant particles
MACDERMID INC25 citations91
US4831210AMay 16, 1989
Shields for electromagnetic radiation
MACDERMID INC29 citations91
US4597988AJul 1, 1986
Process for preparing printed circuit board thru-holes
MACDERMID INC40 citations91
US4279948AJul 21, 1981
Electroless copper deposition solution using a hypophosphite reducing agent
MACDERMID INC44 citations91
US4209331AJun 24, 1980
Electroless copper composition solution using a hypophosphite reducing agent
MACDERMID INC49 citations91
US6020029AFeb 1, 2000
Process for treating metal surfaces
MACDERMID INC35 citations90
US5962111AOct 5, 1999
Compressible printing plates and manufacturing process therefor
MACDERMID INC18 citations90
US5814163ASep 29, 1998
Composition and process for cleaning inks form various surfaces including printing plates
MACDERMID INC32 citations90
US5792278AAug 11, 1998
Process for cleaning inks from various surfaces including printing plates
MACDERMID INC25 citations90
US5550006AAug 27, 1996
Phosphating compositions and processes, particularly for use in fabrication of printed circuits utilizing organic resists
MACDERMID INC20 citations90
US5296334AMar 22, 1994
Radiation-curable composition useful for preparation of solder masks
MACDERMID INC48 citations90
US5289630AMar 1, 1994
Process for fabricating multilayer printed circuits
MACDERMID INC35 citations90
US5288377AFeb 22, 1994
Process for the manufacture of printed circuits using electrophoretically deposited organic resists
MACDERMID INC35 citations90
US4844981AJul 4, 1989
Adhesion promoter for printed circuits
MACDERMID INC52 citations90
US4687545AAug 18, 1987
Process for stripping tin or tin-lead alloy from copper
MACDERMID INC33 citations90
US4409037AOct 11, 1983
Adhesion promoter for printed circuits
MACDERMID INC70 citations90
US6197459B1Mar 6, 2001
Photosensitive resin composition useful in fabricating printing plates
MACDERMID INC19 citations89
US6120639ASep 19, 2000
Method for the manufacture of printed circuit boards
MACDERMID INC19 citations89
US5474798ADec 12, 1995
Method for the manufacture of printed circuit boards
MACDERMID INC24 citations89
US5362334ANov 8, 1994
Composition and process for treatment of metallic surfaces
MACDERMID INC33 citations89
US5261154ANov 16, 1993
Process for fabricating multilayer printed circuits
MACDERMID INC34 citations89
Showing the top 50 of 136 patents by PatentIndex Score.