Assignee

MAEKAWA MASANORI

JP·1 granted patent·8 citations·filing 2012–2012

Technology mixA01G1 A41G1 B29C1 H10W1

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0180US8727757B2Molding die set and resin molding apparatus having the sameMAEKAWA MASANORI·Filed 2012·Granted May 20, 2014·8 cites·11 claims

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