Assignee
MAHLER JOACHIM
DE·22 granted patents·1 pending application·55 citations·filing 2005–2012
Top patents by PatentIndex Score
23 records- 0192US8648456B1Embedded integrated circuit package and method for manufacturing an embedded integrated circuit packageMAHLER JOACHIM·Filed 2012·Granted Feb 11, 2014·13 cites·20 claims
- 0287US8916968B2Multichip power semiconductor deviceMAHLER JOACHIM·Filed 2012·Granted Dec 23, 2014·8 cites·21 claims
- 0385US8692361B2Electric device package comprising a laminate and method of making an electric device package comprising a laminateMAHLER JOACHIM·Filed 2012·Granted Apr 8, 2014·7 cites·17 claims
- 0476US8507080B2Thermoplastic-thermosetting composite and method for bonding a thermoplastic material to a thermosetting materialMAHLER JOACHIM·Filed 2006·Granted Aug 13, 2013·7 cites·14 claims
- 0574US8330252B2Integrated circuit device and method for the production thereofMAHLER JOACHIM·Filed 2007·Granted Dec 11, 2012·7 cites·20 claims
- 0670US8749075B2Integrated circuits and a method for manufacturing an integrated circuitMAHLER JOACHIM·Filed 2012·Granted Jun 10, 2014·3 cites·20 claims
- 0770US8178390B2Semiconductor component and production methodMAHLER JOACHIM·Filed 2006·Granted May 15, 2012·3 cites·11 claims
- 0868US8835219B2Device contact, electric device package and method of manufacturing an electric device packageMAHLER JOACHIM·Filed 2012·Granted Sep 16, 2014·2 cites·21 claims
- 0965US8110906B2Semiconductor device including isolation layerMAHLER JOACHIM·Filed 2007·Granted Feb 7, 2012·2 cites·14 claims
- 1064US9313897B2Method for electrophoretically depositing a film on an electronic assemblyMAHLER JOACHIM·Filed 2012·Granted Apr 12, 2016·1 cites·14 claims
- 1161US9318473B2Semiconductor device including a polymer disposed on a carrierMAHLER JOACHIM·Filed 2012·Granted Apr 19, 2016·1 cites·25 claims
- 1258US8187964B2Integrated circuit device and methodMAHLER JOACHIM·Filed 2009·Granted May 29, 2012·1 cites·17 claims
- 1353US8440733B2Semiconductor component and production methodMAHLER JOACHIM·Filed 2012·Granted May 14, 2013·0 cites·18 claims
- 1452US8519547B2Chip arrangement and method for producing a chip arrangementMAHLER JOACHIM·Filed 2012·Granted Aug 27, 2013·0 cites·14 claims
- 1552US8129831B2Chip arrangement and method for producing a chip arrangementMAHLER JOACHIM·Filed 2007·Granted Mar 6, 2012·0 cites·9 claims
- 1650US8947886B2Electronic componentMAHLER JOACHIM·Filed 2011·Granted Feb 3, 2015·0 cites·26 claims
- 1749US8288207B2Method of manufacturing semiconductor devicesMAHLER JOACHIM·Filed 2009·Granted Oct 16, 2012·0 cites·20 claims
- 1847US9953952B2Semiconductor device having a sealant layer including carbon directly contact the chip and the carrierMAHLER JOACHIM·Filed 2008·Granted Apr 24, 2018·0 cites·6 claims
- 1947US8912450B2Method for attaching a metal surface to a carrier, a method for attaching a chip to a chip carrier, a chip-packaging module and a packaging moduleMAHLER JOACHIM·Filed 2011·Granted Dec 16, 2014·0 cites·6 claims
- 2045US8847385B2Chip arrangement, a method for forming a chip arrangement, a chip package, a method for forming a chip packageMAHLER JOACHIM·Filed 2012·Granted Sep 30, 2014·0 cites·25 claims
- 2144US8450148B2Molding compound adhesion for map-molded flip-chipMAHLER JOACHIM·Filed 2006·Granted May 28, 2013·0 cites·10 claims
- 2242US9082706B2Semiconductor device with a semiconductor chip and electrical connecting elements to a conductor structureMAHLER JOACHIM·Filed 2005·Granted Jul 14, 2015·0 cites·5 claims
- 2341US2007262426A1Semiconductor Housings Having Coupling CoatingsMAHLER JOACHIM·Filed 2005·Application pending·0 cites
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