Assignee
MALATKAR PRAMOD
US5 patents
Top patents by PatentIndex Score
US9224674B2Dec 29, 2015
Packaged semiconductor die with bumpless die-package interface for bumpless build-up layer (BBUL) packages
MALATKAR PRAMOD38 citations93
US8848380B2Sep 30, 2014
Bumpless build-up layer package warpage reduction
MALATKAR PRAMOD17 citations91
US8754516B2Jun 17, 2014
Bumpless build-up layer package with pre-stacked microelectronic devices
MALATKAR PRAMOD4 citations72
US9414484B2Aug 9, 2016
Thermal expansion compensators for controlling microelectronic package warpage
MALATKAR PRAMOD4 citations71
US9159649B2Oct 13, 2015
Microelectronic package and stacked microelectronic assembly and computing system containing same
MALATKAR PRAMOD0 citations40