Assignee
MAMIDALA AMITH R
US3 patents
Top patents by PatentIndex Score
US8904118B2Dec 2, 2014
Mechanisms for efficient intra-die/intra-chip collective messaging
MAMIDALA AMITH R8 citations82
US8990514B2Mar 24, 2015
Mechanisms for efficient intra-die/intra-chip collective messaging
MAMIDALA AMITH R3 citations61
US8943516B2Jan 27, 2015
Mechanism for optimized intra-die inter-nodelet messaging communication
MAMIDALA AMITH R0 citations40