Individual holder
MANEPALLI RAHUL N
US·2 granted patents·2 pending applications·12 citations·filing 2005–2011
Individually held — no corporate assignee on record.
Top patents by PatentIndex Score
4 records- 0187US8466559B2Forming die backside coating structures with coreless packagesMANEPALLI RAHUL N·Filed 2010·Granted Jun 18, 2013·9 cites·17 claims
- 0273US8093105B2Method of fabricating a capillary-flow underfill compositionsMANEPALLI RAHUL N·Filed 2011·Granted Jan 10, 2012·3 cites·10 claims
- 0342US2008237842A1Thermally conductive molding compounds for heat dissipation in semiconductor packagesMANEPALLI RAHUL N·Filed 2007·Application pending·0 cites
- 0438US2006038276A1Methods and systems for attaching die in stacked-die packagesMANEPALLI RAHUL N·Filed 2005·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →