Assignee
MANIWA SUSUMU
JP·3 granted patents·2 citations·filing 2009–2011
Technology mixH10W3
Top patents by PatentIndex Score
3 records- 0161US8535987B2Method of manufacturing substrate for semiconductor element, and semiconductor deviceMANIWA SUSUMU·Filed 2011·Granted Sep 17, 2013·2 cites·3 claims
- 0250US8546940B2Manufacturing method of lead frame substrate and semiconductor apparatusMANIWA SUSUMU·Filed 2009·Granted Oct 1, 2013·0 cites·4 claims
- 0336US8466547B2Method for manufacturing substrate for semiconductor element, and semiconductor deviceMANIWA SUSUMU·Filed 2011·Granted Jun 18, 2013·0 cites·6 claims
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