Assignee
MARKOVICH VOYA
US·3 granted patents·5 citations·filing 2010–2010
Technology mixH05K3
Top patents by PatentIndex Score
3 records- 0174US8541687B2Coreless layer buildup structureMARKOVICH VOYA·Filed 2010·Granted Sep 24, 2013·3 cites·18 claims
- 0268US8536459B2Coreless layer buildup structure with LGAMARKOVICH VOYA·Filed 2010·Granted Sep 17, 2013·2 cites·18 claims
- 0343US9351408B2Coreless layer buildup structure with LGA and joining layerMARKOVICH VOYA·Filed 2010·Granted May 24, 2016·0 cites·27 claims
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