Assignee
MARTINSCHITZ KLAUS
AT·2 granted patents·9 citations·filing 2011–2012
Top patents by PatentIndex Score
2 records- 0180US9067363B2Method and device for permanent bonding of wafers, as well as cutting toolMARTINSCHITZ KLAUS·Filed 2012·Granted Jun 30, 2015·6 cites·11 claims
- 0265US10163681B2Method for permanently bonding wafers by a connecting layer by means of solid state diffusion or phase transformationMARTINSCHITZ KLAUS·Filed 2011·Granted Dec 25, 2018·3 cites·26 claims
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