Assignee
MATAYABAS JR JAMES C
US·4 granted patents·0 citations·filing 2010–2014
Top patents by PatentIndex Score
4 records- 0164US9646903B2Thermoset polymides for microelectronic applicationsMATAYABAS JR JAMES C·Filed 2014·Granted May 9, 2017·0 cites·7 claims
- 0252US8431223B2Low coefficient of thermal expansion (CTE) thermosetting resins for integrated circuit applicationsMATAYABAS JR JAMES C·Filed 2012·Granted Apr 30, 2013·0 cites·9 claims
- 0350US8242216B2Low coefficient of thermal expansion (CTE) thermosetting resins for integrated circuit applicationsMATAYABAS JR JAMES C·Filed 2011·Granted Aug 14, 2012·0 cites·9 claims
- 0446US8901716B2Dielectric film with low coefficient of thermal expansion (CTE) using liquid crystalline resinMATAYABAS JR JAMES C·Filed 2010·Granted Dec 2, 2014·0 cites·18 claims
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