P

Assignee

MATHEW VARUGHESE

US6 patents

Top patents by PatentIndex Score

US9012263B1Apr 21, 2015

Method for treating a bond pad of a package substrate

MATHEW VARUGHESE42 citations93
US8168468B2May 1, 2012

Method of making a semiconductor device including a bridgeable material

MATHEW VARUGHESE11 citations83
US10325876B2Jun 18, 2019

Surface finish for wirebonding

MATHEW VARUGHESE4 citations72
US8955388B2Feb 17, 2015

Mold compound compatibility test system and methods thereof

MATHEW VARUGHESE2 citations62
US8394713B2Mar 12, 2013

Method of improving adhesion of bond pad over pad metallization with a neighboring passivation layer by depositing a palladium layer

MATHEW VARUGHESE4 citations62
US9117756B2Aug 25, 2015

Encapsulant with corrosion inhibitor

MATHEW VARUGHESE0 citations51