Assignee
MATSUDA TAKAYUKI
JP·1 granted patent·2 pending applications·0 citations·filing 2006–2009
Top patents by PatentIndex Score
3 records- 0140US2007164440A1Semiconductor device, dicing saw and method for manufacturing the semiconductor deviceMATSUDA TAKAYUKI·Filed 2006·Application pending·0 cites
- 0238US8168666B2Substituted carbinol compoundMATSUDA TAKAYUKI·Filed 2007·Granted May 1, 2012·0 cites·6 claims
- 0338US2010187584A1Semiconductor device and method for fabricating the sameMATSUDA TAKAYUKI·Filed 2009·Application pending·0 cites
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