Assignee

MATSUYAMA SEIJI

JP·2 granted patents·6 citations·filing 2010–2011

Technology mixH10D2 H10P2 C23C1 H01J1

Top patents by PatentIndex Score

2 records

0181US8288833B2Semiconductor device and manufacturing method thereofMATSUYAMA SEIJI·Filed 2010·Granted Oct 16, 2012·6 cites·11 claims
0248US8183165B2Plasma processing methodMATSUYAMA SEIJI·Filed 2011·Granted May 22, 2012·0 cites·9 claims

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