Assignee
MCCONNELEE PAUL ALAN
US·7 granted patents·66 citations·filing 2008–2012
Top patents by PatentIndex Score
7 records- 0197US8114712B1Method for fabricating a semiconductor device packageMCCONNELEE PAUL ALAN·Filed 2010·Granted Feb 14, 2012·36 cites·22 claims
- 0291US8334593B2Semiconductor device packageMCCONNELEE PAUL ALAN·Filed 2012·Granted Dec 18, 2012·12 cites·14 claims
- 0385US8658473B2Ultrathin buried die module and method of manufacturing thereofMCCONNELEE PAUL ALAN·Filed 2012·Granted Feb 25, 2014·7 cites·20 claims
- 0483US8653670B2Electrical interconnect for an integrated circuit package and method of making sameMCCONNELEE PAUL ALAN·Filed 2010·Granted Feb 18, 2014·5 cites·21 claims
- 0575US8623699B2Method of chip package build-upMCCONNELEE PAUL ALAN·Filed 2010·Granted Jan 7, 2014·4 cites·14 claims
- 0670US9117813B2Integrated circuit package and method of making sameMCCONNELEE PAUL ALAN·Filed 2012·Granted Aug 25, 2015·2 cites·6 claims
- 0749US8742558B2Component protection for advanced packaging applicationsMCCONNELEE PAUL ALAN·Filed 2008·Granted Jun 3, 2014·0 cites·7 claims
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