Assignee
MCLELLAN NEIL
CA·3 granted patents·1 pending application·31 citations·filing 2004–2008
Top patents by PatentIndex Score
4 records- 0178US8610262B1Ball grid array package with improved thermal characteristicsMCLELLAN NEIL·Filed 2005·Granted Dec 17, 2013·9 cites·11 claims
- 0276US8314474B2Under bump metallization for on-die capacitorMCLELLAN NEIL·Filed 2008·Granted Nov 20, 2012·8 cites·30 claims
- 0365US7732914B1Cavity-type integrated circuit packageMCLELLAN NEIL·Filed 2004·Granted Jun 8, 2010·14 cites·4 claims
- 0443US2009032941A1Under Bump Routing Layer Method and ApparatusMCLELLAN NEIL·Filed 2007·Application pending·0 cites
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