Assignee
MCNC
US·91 granted patents·6 pending applications·7,135 citations·filing 1988–2004
Top patents by PatentIndex Score
97 records- 0199US5955817AThermal arched beam microelectromechanical switching arrayMCNC·Filed 1999·Granted Sep 21, 1999·174 cites·5 claims
- 0298US6590267B1Microelectromechanical flexible membrane electrostatic valve device and related fabrication methodsMCNC·Filed 2000·Granted Jul 8, 2003·197 cites·28 claims
- 0398US6057520AArc resistant high voltage micromachined electrostatic switchMCNC·Filed 1999·Granted May 2, 2000·192 cites·43 claims
- 0498US6023121AThermal arched beam microelectromechanical structureMCNC·Filed 1999·Granted Feb 8, 2000·110 cites·7 claims
- 0598US5994816AThermal arched beam microelectromechanical devices and associated fabrication methodsMCNC·Filed 1997·Granted Nov 30, 1999·163 cites·19 claims
- 0698US5914801AMicroelectromechanical devices including rotating plates and related methodsMCNC·Filed 1996·Granted Jun 22, 1999·205 cites·63 claims
- 0798US5909078AThermal arched beam microelectromechanical actuatorsMCNC·Filed 1996·Granted Jun 1, 1999·202 cites·29 claims
- 0898US5475280AVertical microelectronic field emission devicesMCNC·Filed 1994·Granted Dec 12, 1995·321 cites·46 claims
- 0997US6617643B1Low power tunneling metal-oxide-semiconductor (MOS) deviceMCNC·Filed 2002·Granted Sep 9, 2003·152 cites·32 claims
- 1097US6229683B1High voltage micromachined electrostatic switchMCNC·Filed 1999·Granted May 8, 2001·164 cites·42 claims
- 1197US5206557AMicroelectromechanical transducer and fabrication methodMCNC·Filed 1990·Granted Apr 27, 1993·164 cites·43 claims
- 1296US6485273B1Distributed MEMS electrostatic pumping devicesMCNC·Filed 2000·Granted Nov 26, 2002·87 cites·58 claims
- 1396US6377438B1Hybrid microelectromechanical system tunable capacitor and associated fabrication methodsMCNC·Filed 2000·Granted Apr 23, 2002·151 cites·38 claims
- 1496US6373682B1Electrostatically controlled variable capacitorMCNC·Filed 1999·Granted Apr 16, 2002·129 cites·57 claims
- 1596US5767010ASolder bump fabrication methods and structure including a titanium barrier layerMCNC·Filed 1996·Granted Jun 16, 1998·322 cites·35 claims
- 1695US6456420B1Microelectromechanical elevating structuresMCNC·Filed 2000·Granted Sep 24, 2002·145 cites·67 claims
- 1795US6359374B1Miniature electrical relays using a piezoelectric thin film as an actuating elementMCNC·Filed 1999·Granted Mar 19, 2002·80 cites·7 claims
- 1895US5962949AMicroelectromechanical positioning apparatusMCNC·Filed 1997·Granted Oct 5, 1999·102 cites·20 claims
- 1995US5892179ASolder bumps and structures for integrated redistribution routing conductorsMCNC·Filed 1997·Granted Apr 6, 1999·91 cites·20 claims
- 2095US5638469AMicroelectronic module having optical and electrical interconnectsMCNC·Filed 1993·Granted Jun 10, 1997·161 cites·50 claims
- 2195US5325265AHigh performance integrated circuit chip packageMCNC·Filed 1992·Granted Jun 28, 1994·252 cites·29 claims
- 2295US5289631AMethod for testing, burn-in, and/or programming of integrated circuit chipsMCNC·Filed 1992·Granted Mar 1, 1994·222 cites·9 claims
- 2395US5144191AHorizontal microelectronic field emission devicesMCNC·Filed 1991·Granted Sep 1, 1992·121 cites·28 claims
- 2494US6087747AMicroelectromechanical beam for allowing a plate to rotate in relation to a frame in a microelectromechanical deviceMCNC·Filed 1999·Granted Jul 11, 2000·74 cites·4 claims
- 2594US5453661AThin film ferroelectric flat panel display devices, and methods for operating and fabricating sameMCNC·Filed 1994·Granted Sep 26, 1995·88 cites·41 claims
- 2693US6680788B1Scanning apparatus and associated methodMCNC·Filed 2000·Granted Jan 20, 2004·47 cites·30 claims
- 2793US6236491B1Micromachined electrostatic actuator with air gapMCNC·Filed 1999·Granted May 22, 2001·117 cites·71 claims
- 2892US6700309B2Miniature electrical relays using a piezoelectric thin film as an actuating elementMCNC·Filed 2002·Granted Mar 2, 2004·43 cites·8 claims
- 2992US6134042AReflective mems actuator with a laserMCNC·Filed 1999·Granted Oct 17, 2000·62 cites·8 claims
- 3092US5162257ASolder bump fabrication methodMCNC·Filed 1991·Granted Nov 10, 1992·157 cites·20 claims
- 3191US6233088B1Methods for modulating a radiation signalMCNC·Filed 2000·Granted May 15, 2001·43 cites·26 claims
- 3290US6025767AEncapsulated micro-relay modules and methods of fabricating sameMCNC·Filed 1996·Granted Feb 15, 2000·64 cites·44 claims
- 3390US5963793AMicroelectronic packaging using arched solder columnsMCNC·Filed 1998·Granted Oct 5, 1999·98 cites·21 claims
- 3490US5112439AMethod for selectively depositing material on substratesMCNC·Filed 1990·Granted May 12, 1992·136 cites·28 claims
- 3589US6256134B1Microelectromechanical devices including rotating plates and related methodsMCNC·Filed 2000·Granted Jul 3, 2001·28 cites·15 claims
- 3689US6222279B1Solder bump fabrication methods and structures including a titanium barrier layerMCNC·Filed 1998·Granted Apr 24, 2001·103 cites·7 claims
- 3789US5293006ASolder bump including circular lipMCNC·Filed 1992·Granted Mar 8, 1994·106 cites·7 claims
- 3888US6555201B1Method for fabricating a microelectromechanical bearingMCNC·Filed 2000·Granted Apr 29, 2003·51 cites·12 claims
- 3988US5290400AFabrication method for microelectromechanical transducerMCNC·Filed 1992·Granted Mar 1, 1994·46 cites·9 claims
- 4088US5045166AMagnetron method and apparatus for producing high density ionic gas dischargeMCNC·Filed 1990·Granted Sep 3, 1991·66 cites·52 claims
- 4187US6137623AModulatable reflectors and methods for using sameMCNC·Filed 1998·Granted Oct 24, 2000·71 cites·30 claims
- 4287US5237434AMicroelectronic module having optical and electrical interconnectsMCNC·Filed 1991·Granted Aug 17, 1993·75 cites·27 claims
- 4387US5001594AElectrostatic handling deviceMCNC·Filed 1989·Granted Mar 19, 1991·79 cites·21 claims
- 4486US6396620B1Electrostatically actuated electromagnetic radiation shutterMCNC·Filed 2000·Granted May 28, 2002·34 cites·34 claims
- 4586US5371431AVertical microelectronic field emission devices including elongate vertical pillars having resistive bottom portionsMCNC·Filed 1992·Granted Dec 6, 1994·41 cites·24 claims
- 4685US5902686AMethods for forming an intermetallic region between a solder bump and an under bump metallurgy layer and related structuresMCNC·Filed 1996·Granted May 11, 1999·84 cites·23 claims
- 4785US5447264ARecessed via apparatus for testing, burn-in, and/or programming of integrated circuit chips, and for placing solder bumps thereonMCNC·Filed 1994·Granted Sep 5, 1995·79 cites·26 claims
- 4885US5037775AMethod for selectively depositing single elemental semiconductor material on substratesMCNC·Filed 1989·Granted Aug 6, 1991·68 cites·56 claims
- 4984US6593833B2Tunable microwave components utilizing ferroelectric and ferromagnetic composite dielectrics and methods for making sameMCNC·Filed 2001·Granted Jul 15, 2003·21 cites·16 claims
- 5084US5793116AMicroelectronic packaging using arched solder columnsMCNC·Filed 1996·Granted Aug 11, 1998·66 cites·19 claims
Showing the top 50 of 97 patent records by PatentIndex Score.
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