Assignee
MDM INC
KR2 patents
Top patents by PatentIndex Score
US10455697B2Oct 22, 2019
PCB module having multi-sided heat sink structure and multilayer PCB assembly for use in same
MDM INC3 citations63
US9930815B2Mar 27, 2018
Multi-layer PCB having function of dissipating heat from power semiconductor module package and PCB, and production method thereof
MDM INC0 citations42