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MEGIC CORP
TW46 patents
Top patents by PatentIndex Score
US6917119B2Jul 12, 2005
Low fabrication cost, high performance, high reliability chip scale package
MEGIC CORP106 citations99
US6818545B2Nov 16, 2004
Low fabrication cost, fine pitch and high reliability solder bump
MEGIC CORP271 citations99
US6759275B1Jul 6, 2004
Method for making high-performance RF integrated circuits
MEGIC CORP175 citations99
US6756295B2Jun 29, 2004
Chip structure and process for forming the same
MEGIC CORP141 citations99
US6734563B2May 11, 2004
Post passivation interconnection schemes on top of the IC chips
MEGIC CORP79 citations99
US6673698B1Jan 6, 2004
Thin film semiconductor package utilizing a glass substrate with composite polymer/metal interconnect layers
MEGIC CORP100 citations99
US6649509B1Nov 18, 2003
Post passivation metal scheme for high-performance integrated circuit devices
MEGIC CORP156 citations99
US6642136B1Nov 4, 2003
Method of making a low fabrication cost, high performance, high reliability chip scale package
MEGIC CORP123 citations99
US6605528B1Aug 12, 2003
Post passivation metal scheme for high-performance integrated circuit devices
MEGIC CORP151 citations99
US6495442B1Dec 17, 2002
Post passivation interconnection schemes on top of the IC chips
MEGIC CORP207 citations99
US6455885B1Sep 24, 2002
Inductor structure for high performance system-on-chip using post passivation process
MEGIC CORP178 citations99
US6426556B1Jul 30, 2002
Reliable metal bumps on top of I/O pads with test probe marks
MEGIC CORP177 citations99
US6303423B1Oct 16, 2001
Method for forming high performance system-on-chip using post passivation process
MEGIC CORP272 citations99
US7045901B2May 16, 2006
Chip-on-chip connection with second chip located in rectangular open window hole in printed circuit board
MEGIC CORP91 citations98
US6800941B2Oct 5, 2004
Integrated chip package structure using ceramic substrate and method of manufacturing the same
MEGIC CORP76 citations98
US6798073B2Sep 28, 2004
Chip structure and process for forming the same
MEGIC CORP78 citations98
US6762115B2Jul 13, 2004
Chip structure and process for forming the same
MEGIC CORP90 citations98
US6746898B2Jun 8, 2004
Integrated chip package structure using silicon substrate and method of manufacturing the same
MEGIC CORP99 citations98
US6593649B1Jul 15, 2003
Methods of IC rerouting option for multiple package system applications
MEGIC CORP77 citations98
US6515369B1Feb 4, 2003
High performance system-on-chip using post passivation process
MEGIC CORP90 citations98
US6350705B1Feb 26, 2002
Wafer scale packaging scheme
MEGIC CORP83 citations98
US6897507B2May 24, 2005
Capacitor for high performance system-on-chip using post passivation device
MEGIC CORP29 citations96
US6869870B2Mar 22, 2005
High performance system-on-chip discrete components using post passivation process
MEGIC CORP57 citations96
US6815324B2Nov 9, 2004
Reliable metal bumps on top of I/O pads after removal of test probe marks
MEGIC CORP70 citations96
US6620728B2Sep 16, 2003
Top layers of metal for high performance IC's
MEGIC CORP55 citations96
US6586266B1Jul 1, 2003
High performance sub-system design and assembly
MEGIC CORP66 citations96
US6495912B1Dec 17, 2002
Structure of ceramic package with integrated passive devices
MEGIC CORP64 citations96
US6489647B1Dec 3, 2002
Capacitor for high performance system-on-chip using post passivation process structure
MEGIC CORP59 citations96
US6399997B1Jun 4, 2002
High performance system-on-chip using post passivation process and glass substrates
MEGIC CORP60 citations96
US6784087B2Aug 31, 2004
Method of fabricating cylindrical bonding structure
MEGIC CORP60 citations95
US6768208B2Jul 27, 2004
Multiple chips bonded to packaging structure with low noise and multiple selectable functions
MEGIC CORP52 citations95
US6939747B1Sep 6, 2005
Multiple selectable function integrated circuit module
MEGIC CORP13 citations93
US6936531B2Aug 30, 2005
Process of fabricating a chip structure
MEGIC CORP17 citations93
US6806570B1Oct 19, 2004
Thermal compliant semiconductor chip wiring structure for chip scale packaging
MEGIC CORP30 citations93
US6700162B2Mar 2, 2004
Chip structure to improve resistance-capacitance delay and reduce energy loss of the chip
MEGIC CORP35 citations93
US6489656B1Dec 3, 2002
Resistor for high performance system-on-chip using post passivation process
MEGIC CORP31 citations93
US7205646B2Apr 17, 2007
Electronic device and chip package
MEGIC CORP20 citations92
US6791192B2Sep 14, 2004
Multiple chips bonded to packaging structure with low noise and multiple selectable functions
MEGIC CORP16 citations92
US7288845B2Oct 30, 2007
Fabrication of wire bond pads over underlying active devices, passive devices and/or dielectric layers in integrated circuits
MEGIC CORP12 citations84
US6399975B1Jun 4, 2002
Wide bit memory using post passivation interconnection scheme
MEGIC CORP15 citations75
US6809935B1Oct 26, 2004
Thermally compliant PCB substrate for the application of chip scale packages
MEGIC CORP10 citations74
US6387801B1May 14, 2002
Method and an apparatus to electroless plate a metal layer while eliminating the photoelectric effect
MEGIC CORP6 citations74
US6802945B2Oct 12, 2004
Method of metal sputtering for integrated circuit metal routing
MEGIC CORP10 citations72
US6522009B2Feb 18, 2003
Apparatus to electroless plate a metal layer while eliminating the photo electric effect
MEGIC CORP2 citations63
US6768194B2Jul 27, 2004
Electrode for electroplating planar structures
MEGIC CORP4 citations59
US6638840B1Oct 28, 2003
Electrode for electroplating planar structures
MEGIC CORP4 citations59