Assignee
MEIKO ELECTRONICS CO LTD
US·20 granted patents·8 pending applications·386 citations·filing 1987–2021
Top patents by PatentIndex Score
28 records- 0189US4790902AMethod of producing conductor circuit boardsMEIKO ELECTRONICS CO LTD·Filed 1987·Granted Dec 13, 1988·70 cites·8 claims
- 0288US6239983B1Circuit board, manufacturing method therefor, and bump-type contact head and semiconductor component packaging module using the circuit boardMEIKO ELECTRONICS CO LTD·Filed 1998·Granted May 29, 2001·58 cites·6 claims
- 0387US5049221AProcess for producing a copper-clad laminateMEIKO ELECTRONICS CO LTD·Filed 1989·Granted Sep 17, 1991·65 cites·12 claims
- 0485US5886877ACircuit board, manufacturing method therefor, and bump-type contact head and semiconductor component packaging module using the circuit boardMEIKO ELECTRONICS CO LTD·Filed 1996·Granted Mar 23, 1999·54 cites·12 claims
- 0584US6350957B1Circuit board, manufacturing method therefor, and bump-type contact head and semiconductor component packaging module using the circuit boardMEIKO ELECTRONICS CO LTD·Filed 2000·Granted Feb 26, 2002·32 cites·8 claims
- 0681US10244624B2Three-dimensional wiring board production method, three-dimensional wiring board, and substrate for three-dimensional wiring boardMEIKO ELECTRONICS CO LTD·Filed 2015·Granted Mar 26, 2019·3 cites·7 claims
- 0775US7800917B2Printed wiring boardMEIKO ELECTRONICS CO LTD·Filed 2006·Granted Sep 21, 2010·8 cites·2 claims
- 0875US4889584AMethod of producing conductor circuit boardsMEIKO ELECTRONICS CO LTD·Filed 1989·Granted Dec 26, 1989·41 cites·10 claims
- 0973US5096522AProcess for producing copper-clad laminateMEIKO ELECTRONICS CO LTD·Filed 1990·Granted Mar 17, 1992·46 cites·19 claims
- 1071US11128190B2Rotary machine coil using a winding electric wireMEIKO ELECTRONICS CO LTD·Filed 2017·Granted Sep 21, 2021·2 cites·5 claims
- 1171US9326376B2Printed wiring boardMEIKO ELECTRONICS CO LTD·Filed 2014·Granted Apr 26, 2016·3 cites·8 claims
- 1262US10665568B2Encapsulated circuit module, and production method thereforMEIKO ELECTRONICS CO LTD·Filed 2014·Granted May 26, 2020·1 cites·20 claims
- 1361US10537021B2Three-dimensional wiring board production method, three-dimensional wiring board, and substrate for three-dimensional wiring boardMEIKO ELECTRONICS CO LTD·Filed 2018·Granted Jan 14, 2020·0 cites·10 claims
- 1457US10271432B2Encapsulated circuit module, and production method thereforMEIKO ELECTRONICS CO LTD·Filed 2015·Granted Apr 23, 2019·1 cites·10 claims
- 1556US9363885B1Method of fabricating heat dissipating boardMEIKO ELECTRONICS CO LTD·Filed 2013·Granted Jun 7, 2016·1 cites·2 claims
- 1648US2024237189A9Device embedded substrate and manufacturing method of sameMEIKO ELECTRONICS CO LTD·Filed 2021·Application pending·0 cites
- 1746US12009282B2Memory device and memory device moduleMEIKO ELECTRONICS CO LTD·Filed 2021·Granted Jun 11, 2024·0 cites·11 claims
- 1846US2015382478A1Device embedded substrate and manufacturing method of device embedded substrateMEIKO ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 1942US7609526B2Circuit boardMEIKO ELECTRONICS CO LTD·Filed 2005·Granted Oct 27, 2009·1 cites·6 claims
- 2042US2015257284A1Method of bending back rigid printed wiring board with flexible portionMEIKO ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 2140US2016118346A1Device embedded substrate and manufacturing method thereofMEIKO ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 2239US9756732B2Device embedded substrate and manufacturing method of device embedded substrateMEIKO ELECTRONICS CO LTD·Filed 2013·Granted Sep 5, 2017·0 cites·9 claims
- 2338US2016016318A1Suction deviceMEIKO ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 2436US2004136152A1Core substrate, and multilayer circuit board using itMEIKO ELECTRONICS CO LTD·Filed 2001·Application pending·0 cites
- 2534US9793218B2Method for manufacturing device embedded substrate, and device embedded substrateMEIKO ELECTRONICS CO LTD·Filed 2013·Granted Oct 17, 2017·0 cites·12 claims
- 2632US9622352B2Manufacturing method for component incorporated substrate and component incorporated substrateMEIKO ELECTRONICS CO LTD·Filed 2012·Granted Apr 11, 2017·0 cites·4 claims
- 2731US2017347462A1Encapsulated Circuit Module, And Production Method ThereforMEIKO ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
- 2829US2023143088A1Planar antenna boardMEIKO ELECTRONICS CO LTD·Filed 2020·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →