Assignee
MICROELECTRONICS & COMPUTER
US188 patents
Top patents by PatentIndex Score
US5227013AJul 13, 1993
Forming via holes in a multilevel substrate in a single step
MICROELECTRONICS & COMPUTER219 citations99
US5199918AApr 6, 1993
Method of forming field emitter device with diamond emission tips
MICROELECTRONICS & COMPUTER206 citations99
US5173442ADec 22, 1992
Methods of forming channels and vias in insulating layers
MICROELECTRONICS & COMPUTER299 citations99
US5170930ADec 15, 1992
Liquid metal paste for thermal and electrical connections
MICROELECTRONICS & COMPUTER168 citations99
US5091339AFeb 25, 1992
Trenching techniques for forming vias and channels in multilayer electrical interconnects
MICROELECTRONICS & COMPUTER189 citations99
US4991290AFeb 12, 1991
Flexible electrical interconnect and method of making
MICROELECTRONICS & COMPUTER221 citations99
US4926241AMay 15, 1990
Flip substrate for chip mount
MICROELECTRONICS & COMPUTER164 citations99
US4923000AMay 8, 1990
Heat exchanger having piezoelectric fan means
MICROELECTRONICS & COMPUTER162 citations99
US4758926AJul 19, 1988
Fluid-cooled integrated circuit package
MICROELECTRONICS & COMPUTER244 citations99
US5449970ASep 12, 1995
Diode structure flat panel display
MICROELECTRONICS & COMPUTER113 citations98
US5399238AMar 21, 1995
Method of making field emission tips using physical vapor deposition of random nuclei as etch mask
MICROELECTRONICS & COMPUTER110 citations98
US5388068AFeb 7, 1995
Superconductor-semiconductor hybrid memory circuits with superconducting three-terminal switching devices
MICROELECTRONICS & COMPUTER266 citations98
US5379191AJan 3, 1995
Compact adapter package providing peripheral to area translation for an integrated circuit chip
MICROELECTRONICS & COMPUTER185 citations98
US5328087AJul 12, 1994
Thermally and electrically conductive adhesive material and method of bonding with same
MICROELECTRONICS & COMPUTER155 citations98
US5289346AFeb 22, 1994
Peripheral to area adapter with protective bumper for an integrated circuit chip
MICROELECTRONICS & COMPUTER183 citations98
US5272600ADec 21, 1993
Electrical interconnect device with interwoven power and ground lines and capacitive vias
MICROELECTRONICS & COMPUTER115 citations98
US4871316AOct 3, 1989
Printed wire connector
MICROELECTRONICS & COMPUTER180 citations98
US5078852AJan 7, 1992
Plating rack
MICROELECTRONICS & COMPUTER171 citations97
US5686791ANov 11, 1997
Amorphic diamond film flat field emission cathode
MICROELECTRONICS & COMPUTER39 citations96
US5601966AFeb 11, 1997
Methods for fabricating flat panel display systems and components
MICROELECTRONICS & COMPUTER48 citations96
US5551903ASep 3, 1996
Flat panel display based on diamond thin films
MICROELECTRONICS & COMPUTER89 citations96
US5548185AAug 20, 1996
Triode structure flat panel display employing flat field emission cathode
MICROELECTRONICS & COMPUTER82 citations96
US5543684AAug 6, 1996
Flat panel display based on diamond thin films
MICROELECTRONICS & COMPUTER64 citations96
US5536193AJul 16, 1996
Method of making wide band gap field emitter
MICROELECTRONICS & COMPUTER48 citations96
US5503948AApr 2, 1996
Thin cell electrochemical battery system; and method of interconnecting multiple thin cells
MICROELECTRONICS & COMPUTER80 citations96
US5403784AApr 4, 1995
Process for manufacturing a stacked multiple leadframe semiconductor package using an alignment template
MICROELECTRONICS & COMPUTER73 citations96
US5393613AFeb 28, 1995
Composition for three-dimensional metal fabrication using a laser
MICROELECTRONICS & COMPUTER91 citations96
US5382315AJan 17, 1995
Method of forming etch mask using particle beam deposition
MICROELECTRONICS & COMPUTER98 citations96
US5344795ASep 6, 1994
Method for encapsulating an integrated circuit using a removable heatsink support block
MICROELECTRONICS & COMPUTER99 citations96
US5341063AAug 23, 1994
Field emitter with diamond emission tips
MICROELECTRONICS & COMPUTER68 citations96
US5339391AAug 16, 1994
Computer display unit with attribute enhanced scroll bar
MICROELECTRONICS & COMPUTER351 citations96
US5317006AMay 31, 1994
Cylindrical magnetron sputtering system
MICROELECTRONICS & COMPUTER85 citations96
US5314003AMay 24, 1994
Three-dimensional metal fabrication using a laser
MICROELECTRONICS & COMPUTER84 citations96
US5312514AMay 17, 1994
Method of making a field emitter device using randomly located nuclei as an etch mask
MICROELECTRONICS & COMPUTER90 citations96
US5272309ADec 21, 1993
Bonding metal members with multiple laser beams
MICROELECTRONICS & COMPUTER89 citations96
US5244538ASep 14, 1993
Method of patterning metal on a substrate using direct-write deposition of a mask
MICROELECTRONICS & COMPUTER56 citations96
US5240671AAug 31, 1993
Method of forming recessed patterns in insulating substrates
MICROELECTRONICS & COMPUTER58 citations96
US5236551AAug 17, 1993
Rework of polymeric dielectric electrical interconnect by laser photoablation
MICROELECTRONICS & COMPUTER117 citations96
US5167992ADec 1, 1992
Selective electroless plating process for metal conductors
MICROELECTRONICS & COMPUTER112 citations96
US5165166ANov 24, 1992
Method of making a customizable circuitry
MICROELECTRONICS & COMPUTER44 citations96
US5164332ANov 17, 1992
Diffusion barrier for copper features
MICROELECTRONICS & COMPUTER58 citations96
US5135636AAug 4, 1992
Electroplating method
MICROELECTRONICS & COMPUTER132 citations96
US5132878AJul 21, 1992
Customizable circuitry
MICROELECTRONICS & COMPUTER79 citations96
US5120572AJun 9, 1992
Method of fabricating electrical components in high density substrates
MICROELECTRONICS & COMPUTER61 citations96
US5118385AJun 2, 1992
Multilayer electrical interconnect fabrication with few process steps
MICROELECTRONICS & COMPUTER92 citations96
US5113483AMay 12, 1992
Neural network with semi-localized non-linear mapping of the input space
MICROELECTRONICS & COMPUTER116 citations96
US5071518ADec 10, 1991
Method of making an electrical multilayer interconnect
MICROELECTRONICS & COMPUTER127 citations96
US5056706AOct 15, 1991
Liquid metal paste for thermal and electrical connections
MICROELECTRONICS & COMPUTER59 citations96
US5057903AOct 15, 1991
Thermal heat sink encapsulated integrated circuit
MICROELECTRONICS & COMPUTER107 citations96
US5053195AOct 1, 1991
Bonding amalgam and method of making
MICROELECTRONICS & COMPUTER77 citations96
Showing the top 50 of 188 patents by PatentIndex Score.