Assignee
MIGITA TATSUO
JP·5 granted patents·2 pending applications·19 citations·filing 2008–2011
Top patents by PatentIndex Score
7 records- 0185US8703600B2Electronic component and method of connecting with multi-profile bumpsMIGITA TATSUO·Filed 2010·Granted Apr 22, 2014·10 cites·5 claims
- 0276US9190373B2Bump structure with underbump metallization structure and integrated redistribution layerMIGITA TATSUO·Filed 2011·Granted Nov 17, 2015·5 cites·12 claims
- 0368US8704367B2Semiconductor device and manufacturing method of semiconductor deviceMIGITA TATSUO·Filed 2011·Granted Apr 22, 2014·4 cites·11 claims
- 0452US8063487B2Manufacturing method of semiconductor apparatus and semiconductor apparatusMIGITA TATSUO·Filed 2008·Granted Nov 22, 2011·0 cites·9 claims
- 0546US8569181B2Manufacturing method of semiconductor apparatus and semiconductor apparatusMIGITA TATSUO·Filed 2011·Granted Oct 29, 2013·0 cites·9 claims
- 0638US2012068334A1Semiconductor device and manufacturing method thereofMIGITA TATSUO·Filed 2011·Application pending·0 cites
- 0738US2012049367A1Semiconductor device and manufacturing method of semiconductor deviceMIGITA TATSUO·Filed 2011·Application pending·0 cites
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