Assignee
MITSUBISHI CHEMICAL BASF COMPA
JP·10 granted patents·86 citations·filing 1995–2000
Top patents by PatentIndex Score
10 records- 0165US6320006B1Suspension polymerization process using suspending agent-containing slurryMITSUBISHI CHEMICAL BASF COMPA·Filed 2000·Granted Nov 20, 2001·7 cites·7 claims
- 0254US6027806AExpanded resin beadsMITSUBISHI CHEMICAL BASF COMPA·Filed 1998·Granted Feb 22, 2000·16 cites·10 claims
- 0354US5616413AExpandable styrene resin beads and suspension-polymerization process for producing the sameMITSUBISHI CHEMICAL BASF COMPA·Filed 1995·Granted Apr 1, 1997·14 cites·2 claims
- 0448US5661191AExpandable rubber-modified styrene resin beads, expanded beads thereof, and expanded molded articles obtained therefromMITSUBISHI CHEMICAL BASF COMPA·Filed 1995·Granted Aug 26, 1997·13 cites·6 claims
- 0545US5693683AExpandable styrene resin beads and process for producing the sameMITSUBISHI CHEMICAL BASF COMPA·Filed 1996·Granted Dec 2, 1997·10 cites·5 claims
- 0645US5573982ASlurry composition, shaping method using the same, and fired bodyMITSUBISHI CHEMICAL BASF COMPA·Filed 1995·Granted Nov 12, 1996·11 cites·10 claims
- 0739US5889285ASuspending agent-containing slurry for suspension polymerizationMITSUBISHI CHEMICAL BASF COMPA·Filed 1996·Granted Mar 30, 1999·4 cites·7 claims
- 0838US5837740AExpandable ABS resin beads and process for producing the sameMITSUBISHI CHEMICAL BASF COMPA·Filed 1995·Granted Nov 17, 1998·8 cites·6 claims
- 0934US5739221ASuspension-polymerization process for producing expandable styrene resin beadsMITSUBISHI CHEMICAL BASF COMPA·Filed 1996·Granted Apr 14, 1998·3 cites·18 claims
- 1027US6155505AMethod of producing a suspending agent-containing slurry for suspension polymerizationMITSUBISHI CHEMICAL BASF COMPA·Filed 1997·Granted Dec 5, 2000·0 cites·10 claims
Join the waitlist — get patent alerts
Get an alert when MITSUBISHI CHEMICAL BASF COMPA files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →