Assignee
MITSUKURA KAZUYUKI
JP·1 granted patent·8 pending applications·3 citations·filing 2008–2012
Top patents by PatentIndex Score
9 records- 0168US9309446B2Photosensitive adhesive composition, film-like adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor deviceMITSUKURA KAZUYUKI·Filed 2012·Granted Apr 12, 2016·3 cites·24 claims
- 0241US2011151195A1Photosensitive adhesive composition, and film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer and semiconductor device using the photosensitive adhesive compositionMITSUKURA KAZUYUKI·Filed 2009·Application pending·0 cites
- 0340US2011121435A1Photosensitive adhesive composition, filmy adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device, and process for producing semiconductor deviceMITSUKURA KAZUYUKI·Filed 2009·Application pending·0 cites
- 0439US2010143673A1Photosensitive adhesive composition, film-like adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device and semiconductor device manufacturing methodMITSUKURA KAZUYUKI·Filed 2008·Application pending·0 cites
- 0539US2010295190A1Photosensitive adhesive composition, film-like adhesive, adhesive sheet, method for forming adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device and method for manufacturing semiconductor deviceMITSUKURA KAZUYUKI·Filed 2008·Application pending·0 cites
- 0632US2012256326A1Adhesive composition, semiconductor device making use thereof, and production method thereofMITSUKURA KAZUYUKI·Filed 2010·Application pending·0 cites
- 0731US2012263946A1Semiconductor device, method for manufacturing semiconductor device, and semiconductor wafer provided with adhesive layerMITSUKURA KAZUYUKI·Filed 2010·Application pending·0 cites
- 0831US2012248634A1Method for manufacturing film-like adhesive, adhesive sheet, semiconductor device, and method for manufacturing semiconductor deviceMITSUKURA KAZUYUKI·Filed 2010·Application pending·0 cites
- 0931US2012133061A1Photosensitive adhesive, and film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, and semiconductor device, which are made using sameMITSUKURA KAZUYUKI·Filed 2010·Application pending·0 cites
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