Assignee

MIWA YOSHIHARU

JP·1 granted patent·1 pending application·3 citations·filing 2011–2012

Technology mixB32B2 Y10T2 B23K1 B28D1 B29C1 C03B1

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2 records

0178US9446566B2Laminate, method for cutting laminate, method for processing laminate, and device and method for cutting brittle plate-like objectMIWA YOSHIHARU·Filed 2012·Granted Sep 20, 2016·3 cites·11 claims
0242US2012128952A1Glass film laminateMIWA YOSHIHARU·Filed 2011·Application pending·0 cites

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