Assignee
MIYASAKA MASAHIRO
JP·4 granted patents·1 pending application·10 citations·filing 2006–2011
Top patents by PatentIndex Score
5 records- 0175US8198008B2Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing printed wiring boardMIYASAKA MASAHIRO·Filed 2010·Granted Jun 12, 2012·7 cites·13 claims
- 0263US8105759B2Photosensitive resin composition, and, photosensitive element, method for forming resist pattern, method for manufacturing printed wiring board and method for manufacturing partition wall for plasma display panel using the compositionMIYASAKA MASAHIRO·Filed 2006·Granted Jan 31, 2012·2 cites·2 claims
- 0362US8592130B2Photosensitive resin composition, photosensitive element, method of forming resist pattern and method of producing printed wiring boardMIYASAKA MASAHIRO·Filed 2009·Granted Nov 26, 2013·1 cites·7 claims
- 0440US8192916B2Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing printed wiring boardMIYASAKA MASAHIRO·Filed 2010·Granted Jun 5, 2012·0 cites·16 claims
- 0534US2013298398A1Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring boardMIYASAKA MASAHIRO·Filed 2011·Application pending·0 cites
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