Assignee
MIYOSHI HIDENORI
JP·7 granted patents·1 pending application·477 citations·filing 2007–2012
Top patents by PatentIndex Score
8 records- 0197US8785311B2Film forming method, semiconductor device, manufacturing method thereof and substrate processing apparatus thereforMIYOSHI HIDENORI·Filed 2011·Granted Jul 22, 2014·464 cites·13 claims
- 0285US8653665B2Barrier layer, film forming method, and processing systemMIYOSHI HIDENORI·Filed 2010·Granted Feb 18, 2014·6 cites·12 claims
- 0382US8765221B2Film forming method and film forming apparatusMIYOSHI HIDENORI·Filed 2012·Granted Jul 1, 2014·5 cites·20 claims
- 0467US8114786B2Heat treatment method, heat treatment apparatus and substrate processing apparatusMIYOSHI HIDENORI·Filed 2007·Granted Feb 14, 2012·2 cites·11 claims
- 0550US8310054B2Semiconductor device manufacturing method and target substrate processing systemMIYOSHI HIDENORI·Filed 2011·Granted Nov 13, 2012·0 cites·10 claims
- 0647US8138095B2Method of substrate treatment, process for producing semiconductor device, substrate treating apparatus, and recording mediumMIYOSHI HIDENORI·Filed 2007·Granted Mar 20, 2012·0 cites·17 claims
- 0741US9293417B2Method for forming barrier film on wiring lineMIYOSHI HIDENORI·Filed 2012·Granted Mar 22, 2016·0 cites·17 claims
- 0839US2012006782A1Substrate processing method and substrate processing apparatusMIYOSHI HIDENORI·Filed 2011·Application pending·0 cites
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