Assignee
MOCHIZUKI MASAYUKI
JP·4 granted patents·6 citations·filing 2009–2012
Top patents by PatentIndex Score
4 records- 0167US10096526B2Die bonder and bonding methodMOCHIZUKI MASAYUKI·Filed 2012·Granted Oct 9, 2018·3 cites·10 claims
- 0266US9177937B2Reaction absorber and semiconductor assembling systemMOCHIZUKI MASAYUKI·Filed 2010·Granted Nov 3, 2015·2 cites·16 claims
- 0366US8457505B2Image forming apparatus with heater control and error detection, and control method for the sameMOCHIZUKI MASAYUKI·Filed 2010·Granted Jun 4, 2013·1 cites·14 claims
- 0444US8452202B2Heating device and image forming apparatus with fixing device switched on/off in response to a zero-cross point of an AC voltage output from an AC power sourceMOCHIZUKI MASAYUKI·Filed 2009·Granted May 28, 2013·0 cites·8 claims
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