Assignee
MOHANAKRISHNASWAMY VENKATESH
IN·4 granted patents·2 citations·filing 2009–2012
Top patents by PatentIndex Score
4 records- 0162US8193595B2Method of forming a die having an IC region adjacent a MEMS regionMOHANAKRISHNASWAMY VENKATESH·Filed 2009·Granted Jun 5, 2012·2 cites·22 claims
- 0253US8432006B2High aspect ratio capacitively coupled MEMS devicesMOHANAKRISHNASWAMY VENKATESH·Filed 2011·Granted Apr 30, 2013·0 cites·18 claims
- 0349US8405202B2MEMS packaging scheme using dielectric fenceMOHANAKRISHNASWAMY VENKATESH·Filed 2009·Granted Mar 26, 2013·0 cites·18 claims
- 0445US8853802B2Method of forming a die having an IC region adjacent a MEMS regionMOHANAKRISHNASWAMY VENKATESH·Filed 2012·Granted Oct 7, 2014·0 cites·20 claims
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