Assignee

MOON DONGSOO

KR2 patents

Top patents by PatentIndex Score

US8115293B2Feb 14, 2012

Integrated circuit packaging system with interconnect and method of manufacture thereof

MOON DONGSOO26 citations89

US8692365B2Apr 8, 2014

Integrated circuit packaging system with thermal dispersal structures and method of manufacture thereof

MOON DONGSOO0 citations39