Assignee
MORIKAZU HIROSHI
JP·10 granted patents·37 citations·filing 2007–2012
Top patents by PatentIndex Score
10 records- 0193US9193008B2Laser processing method and laser processing apparatusMORIKAZU HIROSHI·Filed 2012·Granted Nov 24, 2015·14 cites·7 claims
- 0281US8518803B2Laser processing method for semiconductor waferMORIKAZU HIROSHI·Filed 2010·Granted Aug 27, 2013·5 cites·6 claims
- 0381US8314014B2Laser processing apparatus and laser processing methodMORIKAZU HIROSHI·Filed 2010·Granted Nov 20, 2012·5 cites·2 claims
- 0478US8258428B2Laser beam processing machineMORIKAZU HIROSHI·Filed 2007·Granted Sep 4, 2012·6 cites·3 claims
- 0569US8258045B2Device processing methodMORIKAZU HIROSHI·Filed 2010·Granted Sep 4, 2012·2 cites·3 claims
- 0669US8252667B2Laser processing method for semiconductor waferMORIKAZU HIROSHI·Filed 2010·Granted Aug 28, 2012·2 cites·4 claims
- 0768US8513566B2Laser beam processing machineMORIKAZU HIROSHI·Filed 2007·Granted Aug 20, 2013·2 cites·2 claims
- 0865US8759195B2Optical device wafer processing methodMORIKAZU HIROSHI·Filed 2011·Granted Jun 24, 2014·1 cites·4 claims
- 0951US9174306B2Laser processing method for nonlinear crystal substrateMORIKAZU HIROSHI·Filed 2012·Granted Nov 3, 2015·0 cites·14 claims
- 1041US8912464B2Hole forming method and laser processing apparatusMORIKAZU HIROSHI·Filed 2012·Granted Dec 16, 2014·0 cites·2 claims
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