Assignee

MTEC CORP

JP·1 granted patent·1 pending application·1 citations·filing 2012–2016

Technology mixB23K1 B29C1 G01L1 H01L1 H01R1 H05K1

Top patents by PatentIndex Score

2 records

0155US10424514B2Method for manufacturing semiconductor substrateMTEC CORP·Filed 2016·Granted Sep 24, 2019·1 cites·14 claims
0234US2014069716A1Resin molded product and method for producing sameMTEC CORP·Filed 2012·Application pending·0 cites

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