Assignee
MURAKAMI TOMOHIRO
JP·2 granted patents·4 citations·filing 2010–2011
Top patents by PatentIndex Score
2 records- 0172US8319330B2Semiconductor package having exterior plating films formed over surfaces of outer leadsMURAKAMI TOMOHIRO·Filed 2011·Granted Nov 27, 2012·4 cites·23 claims
- 0241US8743276B2Opening/closing door locking device for an electronic deviceMURAKAMI TOMOHIRO·Filed 2010·Granted Jun 3, 2014·0 cites·6 claims
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