Assignee
MURASUGI NARUTOSHI
JP·3 granted patents·1 citations·filing 2011–2011
Top patents by PatentIndex Score
3 records- 0160US9492867B2Forming die assembly for microcomponentsMURASUGI NARUTOSHI·Filed 2011·Granted Nov 15, 2016·1 cites·2 claims
- 0242US8851872B2Forming die assembly for microcomponentsMURASUGI NARUTOSHI·Filed 2011·Granted Oct 7, 2014·0 cites·4 claims
- 0340US8850494B2Forming die assembly for microcomponentsMURASUGI NARUTOSHI·Filed 2011·Granted Sep 30, 2014·0 cites·4 claims
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