Assignee
MURAYAMA KEI
JP9 patents
Top patents by PatentIndex Score
US8148738B2Apr 3, 2012
Semiconductor device having an element mounted on a substrate and an electrical component connected to the element
MURAYAMA KEI8 citations84
US9112421B2Aug 18, 2015
Converter circuit including switch element unit
MURAYAMA KEI2 citations62
US8598684B2Dec 3, 2013
Semiconductor device, and method of manufacturing the same
MURAYAMA KEI2 citations62
US8394678B2Mar 12, 2013
Semiconductor chip stacked body and method of manufacturing the same
MURAYAMA KEI2 citations62
US8338289B2Dec 25, 2012
Method of manufacturing a semiconductor chip including a semiconductor substrate and a through via provided in a through hole
MURAYAMA KEI3 citations62
US8169073B2May 1, 2012
Semiconductor device and electronic apparatus of multi-chip packaging
MURAYAMA KEI3 citations62
US8674499B2Mar 18, 2014
Heat radiation component and semiconductor package including same
MURAYAMA KEI3 citations60
US8622556B2Jan 7, 2014
Frame-attached anti-reflection glass and method of manufacturing the same
MURAYAMA KEI0 citations52
US8129830B2Mar 6, 2012
Electronic component package and method of manufacturing the same, and electronic component device
MURAYAMA KEI1 citations52