Assignee
NAGAMATSU MASAYUKI
JP·4 granted patents·2 pending applications·15 citations·filing 2007–2010
Top patents by PatentIndex Score
6 records- 0185US8269298B2Semiconductor module and camera module mounting said semiconductor moduleNAGAMATSU MASAYUKI·Filed 2010·Granted Sep 18, 2012·9 cites·13 claims
- 0265US8153186B2Packaging board and manufacturing method therefor, semiconductor module and mobile apparatusNAGAMATSU MASAYUKI·Filed 2009·Granted Apr 10, 2012·3 cites·6 claims
- 0361US8068343B2Semiconductor module, portable device and method for manufacturing semiconductor moduleNAGAMATSU MASAYUKI·Filed 2007·Granted Nov 29, 2011·2 cites·12 claims
- 0459US8440915B2Device mounting board and semiconductor moduleNAGAMATSU MASAYUKI·Filed 2010·Granted May 14, 2013·1 cites·10 claims
- 0550US2011174527A1Element mounting board, semiconductor module, semiconductor device, method for fabricating the element mounting board, and method for fabricating semiconductor deviceNAGAMATSU MASAYUKI·Filed 2009·Application pending·0 cites
- 0648US2010288550A1ELEMENT MOUNTING SUBSTRATE AND METHOD OF FABRICATING THE SAME, CIRCUIT DEVICE AND METHOD OF FABRICATING THE SAME, AND MOBILE APPLIANCE ( as amendedNAGAMATSU MASAYUKI·Filed 2008·Application pending·0 cites
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