Assignee
NAKAGAWA SHIGEYUKI
JP·3 granted patents·1 pending application·13 citations·filing 2007–2012
Top patents by PatentIndex Score
4 records- 0173US8476549B2Method for bonding a seal member and dissimilar materials made from metalsNAKAGAWA SHIGEYUKI·Filed 2007·Granted Jul 2, 2013·8 cites·15 claims
- 0272US8492005B2Joining method and joint structure of dissimilar metalNAKAGAWA SHIGEYUKI·Filed 2009·Granted Jul 23, 2013·4 cites·15 claims
- 0357US9505084B2Joining method and joining componentNAKAGAWA SHIGEYUKI·Filed 2012·Granted Nov 29, 2016·1 cites·15 claims
- 0438US2013323531A1Bonded body of electrically conductive materialsNAKAGAWA SHIGEYUKI·Filed 2011·Application pending·0 cites
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