Assignee
NAKAKO HIDEO
JP·3 granted patents·3 pending applications·11 citations·filing 2008–2012
Top patents by PatentIndex Score
6 records- 0182US9457406B2Copper metal film, method for producing same, copper metal pattern, conductive wiring line using the copper metal pattern, copper metal bump, heat conduction path, bonding material, and liquid compositionNAKAKO HIDEO·Filed 2010·Granted Oct 4, 2016·5 cites·13 claims
- 0280US9676969B2Composition set, conductive substrate and method of producing the same, and conductive adhesive compositionNAKAKO HIDEO·Filed 2012·Granted Jun 13, 2017·3 cites·18 claims
- 0363US8801971B2Copper conductor film and manufacturing method thereof, conductive substrate and manufacturing method thereof, copper conductor wiring and manufacturing method thereof, and treatment solutionNAKAKO HIDEO·Filed 2008·Granted Aug 12, 2014·3 cites·7 claims
- 0448US2010233011A1Method for forming a copper wiring pattern, and copper oxide particle dispersed slurry used thereinNAKAKO HIDEO·Filed 2008·Application pending·0 cites
- 0547US2009134386A1Organic Field Effect TransistorNAKAKO HIDEO·Filed 2008·Application pending·0 cites
- 0639US2012170241A1Printing ink, metal nanoparticles used in the same, wiring, circuit board, and semiconductor packageNAKAKO HIDEO·Filed 2010·Application pending·0 cites
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