Assignee
NAKAMURA TAICHI
JP·4 granted patents·1 pending application·9 citations·filing 2009–2012
Top patents by PatentIndex Score
5 records- 0178US8810035B2Semiconductor bonding structure body and manufacturing method of semiconductor bonding structure bodyNAKAMURA TAICHI·Filed 2011·Granted Aug 19, 2014·5 cites·4 claims
- 0272US8480806B2Bonding structure and semiconductor device manufacturing apparatusNAKAMURA TAICHI·Filed 2009·Granted Jul 9, 2013·4 cites·7 claims
- 0342US8268718B2Bonded structure and manufacturing method for bonded structureNAKAMURA TAICHI·Filed 2011·Granted Sep 18, 2012·0 cites·3 claims
- 0439US2014103531A1Bonded structureNAKAMURA TAICHI·Filed 2012·Application pending·0 cites
- 0538US8691377B2Semiconductor deviceNAKAMURA TAICHI·Filed 2010·Granted Apr 8, 2014·0 cites·6 claims
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