Assignee
NAKASATO MAYUMI
JP·4 granted patents·1 pending application·8 citations·filing 2008–2012
Top patents by PatentIndex Score
5 records- 0176US8258620B2Circuit device, method of manufacturing the circuit device, device mounting board and semiconductor moduleNAKASATO MAYUMI·Filed 2008·Granted Sep 4, 2012·6 cites·5 claims
- 0257US8592257B2Method for manufacturing semiconductor modulesNAKASATO MAYUMI·Filed 2012·Granted Nov 26, 2013·1 cites·2 claims
- 0357US8283568B2Device mounting board, and semiconductor module and manufacturing method thereforNAKASATO MAYUMI·Filed 2009·Granted Oct 9, 2012·1 cites·5 claims
- 0451US2011241203A1Semiconductor module, method for manufacturing semiconductor module, and portable apparatusNAKASATO MAYUMI·Filed 2009·Application pending·0 cites
- 0550US8183090B2Methods for manufacturing device mounting board and circuit substrateNAKASATO MAYUMI·Filed 2010·Granted May 22, 2012·0 cites·8 claims
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