Assignee
NCHIP INC
US·6 granted patents·626 citations·filing 1990–1996
Top patents by PatentIndex Score
6 records- 0196US5397997ABurn-in technologies for unpackaged integrated circuitsNCHIP INC·Filed 1993·Granted Mar 14, 1995·263 cites·24 claims
- 0291US5804004AStacked devices for multichip modulesNCHIP INC·Filed 1996·Granted Sep 8, 1998·191 cites·18 claims
- 0382US5541524ABurn-in technologies for unpackaged integrated circuitsNCHIP INC·Filed 1993·Granted Jul 30, 1996·69 cites·22 claims
- 0477US5274270AMultichip module having SiO2 insulating layerNCHIP INC·Filed 1993·Granted Dec 28, 1993·52 cites·6 claims
- 0563US5134539AMultichip module having integral decoupling capacitorNCHIP INC·Filed 1990·Granted Jul 28, 1992·39 cites·32 claims
- 0641US5214844AMethod of assembling integrated circuits to a silicon boardNCHIP INC·Filed 1990·Granted Jun 1, 1993·12 cites·16 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →