Assignee
NEFF JAMES G
US·3 granted patents·10 citations·filing 2009–2012
Top patents by PatentIndex Score
3 records- 0173US8236582B2Controlling edge emission in package-free LED dieNEFF JAMES G·Filed 2009·Granted Aug 7, 2012·5 cites·21 claims
- 0270US8202741B2Method of bonding a semiconductor device using a compliant bonding structureNEFF JAMES G·Filed 2009·Granted Jun 19, 2012·4 cites·15 claims
- 0361US9076944B2Method of bonding a semiconductor device using a compliant bonding structureNEFF JAMES G·Filed 2012·Granted Jul 7, 2015·1 cites·19 claims
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