Assignee
NG HONG WAN
SG·2 granted patents·5 citations·filing 2011–2014
Top patents by PatentIndex Score
2 records- 0182US8754537B2Build-up package for integrated circuit devices, and methods of making sameNG HONG WAN·Filed 2011·Granted Jun 17, 2014·4 cites·4 claims
- 0269US9355994B2Build-up package for integrated circuit devices, and methods of making sameNG HONG WAN·Filed 2014·Granted May 31, 2016·1 cites·24 claims
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