Assignee
NG MAN CHUNG
HK·4 granted patents·45 citations·filing 2011–2012
Top patents by PatentIndex Score
4 records- 0192US8821659B2Apparatus and method for real-time alignment and lamination of substratesNG MAN CHUNG·Filed 2012·Granted Sep 2, 2014·42 cites·17 claims
- 0266US8633089B2Die bonding method utilizing rotary wafer tableNG MAN CHUNG·Filed 2011·Granted Jan 21, 2014·3 cites·12 claims
- 0331US8905109B2Apparatus for bonding substrates to each otherNG MAN CHUNG·Filed 2011·Granted Dec 9, 2014·0 cites·6 claims
- 0430US8336757B2Apparatus for transporting substrates for bondingNG MAN CHUNG·Filed 2011·Granted Dec 25, 2012·0 cites·20 claims
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