Assignee
NGK ELECTRONICS DEVICES INC
JP·9 granted patents·6 pending applications·6 citations·filing 2017–2024
Top patents by PatentIndex Score
15 records- 0188US10790245B2High-frequency ceramic board and high-frequency semiconductor element packageNGK ELECTRONICS DEVICES INC·Filed 2018·Granted Sep 29, 2020·6 cites·10 claims
- 0261US2025100925A1Sintered bodyNGK ELECTRONICS DEVICES INC·Filed 2024·Application pending·0 cites
- 0359US2025024592A1Ceramic wiring memberNGK ELECTRONICS DEVICES INC·Filed 2024·Application pending·0 cites
- 0459US2025024599A1Ceramic wiring memberNGK ELECTRONICS DEVICES INC·Filed 2024·Application pending·0 cites
- 0557US12209313B2Metal member and production method thereforNGK ELECTRONICS DEVICES INC·Filed 2021·Granted Jan 28, 2025·0 cites·14 claims
- 0654US2024107678A1Method of manufacturing bonded substrate, method of manufacturing circuit substrate, and circuit substrateNGK ELECTRONICS DEVICES INC·Filed 2023·Application pending·0 cites
- 0753US2023335568A1PackageNGK ELECTRONICS DEVICES INC·Filed 2023·Application pending·0 cites
- 0851US11854934B2Package with heat dissipating substrateNGK ELECTRONICS DEVICES INC·Filed 2022·Granted Dec 26, 2023·0 cites·5 claims
- 0946US11929301B2Package and electronic deviceNGK ELECTRONICS DEVICES INC·Filed 2022·Granted Mar 12, 2024·0 cites·8 claims
- 1045US11978682B2Package, and method for manufacturing power semiconductor moduleNGK ELECTRONICS DEVICES INC·Filed 2021·Granted May 7, 2024·0 cites·8 claims
- 1145US11901268B2Package with an electrode-attached frame supported by a heat sink, and method for manufacturing power semiconductor module provided therewithNGK ELECTRONICS DEVICES INC·Filed 2021·Granted Feb 13, 2024·0 cites·11 claims
- 1245US11178762B2Connection structure for wiring substrate and flexible substrate and package for housing electronic componentsNGK ELECTRONICS DEVICES INC·Filed 2020·Granted Nov 16, 2021·0 cites·8 claims
- 1345US2022020651A1Power semiconductor module and manufacturing method for power semiconductor moduleNGK ELECTRONICS DEVICES INC·Filed 2021·Application pending·0 cites
- 1444US11849538B2Composite wiring board, package, and electronic deviceNGK ELECTRONICS DEVICES INC·Filed 2021·Granted Dec 19, 2023·0 cites·10 claims
- 1524US10937715B2Substrate for power module, collective substrate for power modules, and method for manufacturing substrate for power moduleNGK ELECTRONICS DEVICES INC·Filed 2017·Granted Mar 2, 2021·0 cites·4 claims
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →