Assignee
NING XIAN J
CN·2 granted patents·3 citations·filing 2004–2011
Top patents by PatentIndex Score
2 records- 0145US8395240B2Bond pad for low K dielectric materials and method for manufacture for semiconductor devicesNING XIAN J·Filed 2011·Granted Mar 12, 2013·0 cites·19 claims
- 0245US8158520B2Method of forming a via structure dual damascene structure for the manufacture of semiconductor integrated circuit devicesNING XIAN J·Filed 2004·Granted Apr 17, 2012·3 cites·16 claims
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