Assignee
NIPPON DENNETSU KEIKI KK
JP·25 granted patents·1 pending application·488 citations·filing 1981–2006
Top patents by PatentIndex Score
26 records- 0188US4938410ASoldering apparatus of a reflow typeNIPPON DENNETSU KEIKI KK·Filed 1989·Granted Jul 3, 1990·48 cites·6 claims
- 0283US4874081ADevice for transferring printed circuit boardNIPPON DENNETSU KEIKI KK·Filed 1988·Granted Oct 17, 1989·35 cites·7 claims
- 0383US4465219ASoldering apparatusNIPPON DENNETSU KEIKI KK·Filed 1982·Granted Aug 14, 1984·33 cites·5 claims
- 0481US4876437ASoldering apparatusNIPPON DENNETSU KEIKI KK·Filed 1988·Granted Oct 24, 1989·34 cites·6 claims
- 0578US6902102B2Soldering method and solder joint memberNIPPON DENNETSU KEIKI KK·Filed 2003·Granted Jun 7, 2005·20 cites·8 claims
- 0675US5145055ADevice for conveying printed circuit boardNIPPON DENNETSU KEIKI KK·Filed 1991·Granted Sep 8, 1992·30 cites·4 claims
- 0774US4530458ASoldering apparatusNIPPON DENNETSU KEIKI KK·Filed 1983·Granted Jul 23, 1985·22 cites·18 claims
- 0870US5769305AApparatus for wave soldering printed wiring boardsNIPPON DENNETSU KEIKI KK·Filed 1996·Granted Jun 23, 1998·37 cites·5 claims
- 0966US4712963AApparatus for soldering printed circuit boardsNIPPON DENNETSU KEIKI KK·Filed 1983·Granted Dec 15, 1987·18 cites·5 claims
- 1064US6116491AGas flow controlling device and soldering apparatus using sameNIPPON DENNETSU KEIKI KK·Filed 1998·Granted Sep 12, 2000·36 cites·13 claims
- 1164US4889273ASoldering apparatusNIPPON DENNETSU KEIKI KK·Filed 1988·Granted Dec 26, 1989·19 cites·3 claims
- 1264US4726506ASoldering apparatusNIPPON DENNETSU KEIKI KK·Filed 1986·Granted Feb 23, 1988·19 cites·4 claims
- 1363US5180096AMethod and apparatus for reflow-soldering of printed circuit boardsNIPPON DENNETSU KEIKI KK·Filed 1991·Granted Jan 19, 1993·26 cites·5 claims
- 1463US4848642ASoldering apparatusNIPPON DENNETSU KEIKI KK·Filed 1987·Granted Jul 18, 1989·18 cites·13 claims
- 1558US5066850ASoldering apparatus of a reflow typeNIPPON DENNETSU KEIKI KK·Filed 1989·Granted Nov 19, 1991·15 cites·3 claims
- 1655US4535722AApparatus for applying molten wax onto printed circuit boardNIPPON DENNETSU KEIKI KK·Filed 1983·Granted Aug 20, 1985·13 cites·7 claims
- 1753US4398554AFlux control deviceNIPPON DENNETSU KEIKI KK·Filed 1981·Granted Aug 16, 1983·12 cites·5 claims
- 1850US7176388B2Soldering method and solder joint memberNIPPON DENNETSU KEIKI KK·Filed 2004·Granted Feb 13, 2007·3 cites·4 claims
- 1947US4679721AApparatus for fuse-bonding articlesNIPPON DENNETSU KEIKI KK·Filed 1986·Granted Jul 14, 1987·11 cites·8 claims
- 2046US5358167ASoldering apparatusNIPPON DENNETSU KEIKI KK·Filed 1993·Granted Oct 25, 1994·12 cites·10 claims
- 2145US5145100ASoldering apparatusNIPPON DENNETSU KEIKI KK·Filed 1992·Granted Sep 8, 1992·10 cites·1 claims
- 2237US4570569ASoldering apparatusNIPPON DENNETSU KEIKI KK·Filed 1984·Granted Feb 18, 1986·7 cites·7 claims
- 2336US6726082B2Soldering apparatusNIPPON DENNETSU KEIKI KK·Filed 2002·Granted Apr 27, 2004·4 cites·24 claims
- 2434US4681249AVapor phase soldering apparatusNIPPON DENNETSU KEIKI KK·Filed 1986·Granted Jul 21, 1987·4 cites·6 claims
- 2533US2007068994A1Soldering apparatusNIPPON DENNETSU KEIKI KK·Filed 2006·Application pending·0 cites
- 2631US4913334ADevice for correcting warp of printed circuit boards in a carrierless soldering apparatusNIPPON DENNETSU KEIKI KK·Filed 1989·Granted Apr 3, 1990·2 cites·6 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →