Assignee

NIPPON MICROMETAL COPORATION

JP·0 granted patents·1 pending application·0 citations·filing 2023–2023

Technology mixB32B1 C22C1 C25D1 H01L1 H10W1

Top patents by PatentIndex Score

1 record

0168US2023335528A1Bonding wire for semiconductor devicesNIPPON MICROMETAL COPORATION·Filed 2023·Application pending·0 cites

Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →