Assignee
NISHIMURA TAKAO
JP13 patents
Top patents by PatentIndex Score
US8748229B2Jun 10, 2014
Manufacturing method including deformation of supporting board to accommodate semiconductor device
NISHIMURA TAKAO8 citations84
US8198728B2Jun 12, 2012
Semiconductor device and plural semiconductor elements with suppressed bending
NISHIMURA TAKAO9 citations84
US8841776B2Sep 23, 2014
Stacked semiconductor chips having double adhesive insulating layer interposed therebetween
NISHIMURA TAKAO11 citations82
US8134240B2Mar 13, 2012
Semiconductor device and manufacturing method for the same
NISHIMURA TAKAO7 citations82
US8076785B2Dec 13, 2011
Semiconductor device
NISHIMURA TAKAO6 citations73
US8810043B2Aug 19, 2014
Semiconductor device
NISHIMURA TAKAO4 citations72
US8404980B2Mar 26, 2013
Relay board and semiconductor device having the relay board
NISHIMURA TAKAO2 citations63
US8125789B2Feb 28, 2012
Wiring substrate and electronic device
NISHIMURA TAKAO3 citations63
US9076559B2Jul 7, 2015
Method of operating nuclear plant
NISHIMURA TAKAO2 citations59
US8659168B2Feb 25, 2014
Wiring board for flip-chip mounting, mounting structure of electronic components on wiring board, and semiconductor device including wiring board
NISHIMURA TAKAO1 citations51
US8076769B2Dec 13, 2011
Semiconductor device and manufacturing method of semiconductor device
NISHIMURA TAKAO1 citations51
US8230590B2Jul 31, 2012
Method for mounting electronic components
NISHIMURA TAKAO1 citations50
US9134433B2Sep 15, 2015
Nuclear reactor fuel integrity monitor
NISHIMURA TAKAO0 citations45