Assignee
NOGAMI TAKESHI
US·4 granted patents·1 pending application·20 citations·filing 2005–2012
Top patents by PatentIndex Score
5 records- 0191US8525232B2Semiconductor structure having a wetting layerNOGAMI TAKESHI·Filed 2011·Granted Sep 3, 2013·13 cites·20 claims
- 0284US8399350B2Formation of air gap with protection of metal linesNOGAMI TAKESHI·Filed 2010·Granted Mar 19, 2013·6 cites·16 claims
- 0362US8841212B2Method of making a copper interconnect having a barrier liner of multiple metal layersNOGAMI TAKESHI·Filed 2012·Granted Sep 23, 2014·1 cites·10 claims
- 0441US2007232062A1Damascene interconnection having porous low k layer followed by a nonporous low k layerNOGAMI TAKESHI·Filed 2006·Application pending·0 cites
- 0540US8586468B2Integrated circuit chip stack employing carbon nanotube interconnectsNOGAMI TAKESHI·Filed 2005·Granted Nov 19, 2013·0 cites·6 claims
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